PCB Manufacturing for US Product Teams
Network PCB supplies bare printed circuit boards to companies across the United States, from quick prototype lots to production volumes. We build standard multilayer boards and advanced HDI, flex, rigid-flex and RF designs.
PCB Fabrication From Prototype to Production
Since 1994, Network PCB has supplied printed circuit boards from its base in San Jose, California. Engineering teams use us for first prototypes and for the production orders that follow, so the same design data, stack-up and quality requirements carry through each stage.
We serve customers in every US region. Being a US-based supplier is not the same as fabricating every board in the US. If your program requires a specific manufacturing location, tell us when you request a quote.
Prototype orders
Small quantities for design validation, with DFM feedback before fabrication. Quick-turn scheduling is available.
See PCB prototyping for files, lead times and the move to production.
Production orders
Repeat builds and higher volumes using a confirmed stack-up, test method and documentation set.
See high-volume production for scaling released designs.
Related pages: PCB prototyping · high-volume production · quick-turn PCBs
Board Types We Manufacture
Use the board type that matches your electrical, mechanical and thermal needs:
Multilayer PCBs
High-layer-count rigid boards for digital, mixed-signal and power designs, with controlled-impedance stack-ups.
HDI Boards
Laser-drilled microvias, stacked and staggered vias, and fine-pitch BGA breakout for dense layouts.
Flex & Rigid-Flex
Polyimide-based flexible circuits and rigid-flex constructions for tight or moving packaging.
RF & Microwave PCBs
Rogers, PTFE and other low-loss laminates for high-frequency and wireless designs.
Backplanes
Large-format, thick, high-layer-count boards used in networking and system chassis.
Test Boards: BIB & Probe Cards
Burn-in boards and probe card PCBs for semiconductor test applications.
Product details: multilayer PCBs · HDI boards · flex boards · RF & microwave PCBs · backplanes
Materials and Technical Capabilities
Below is a summary of the fabrication options we support. Exact limits such as layer count, line and space, drill size and aspect ratio depend on the combination of material, thickness and copper weight. They are listed on the specifications & tolerances page and confirmed for each design at quote.
| Area | What is supported |
|---|---|
| Constructions | Single-sided, double-sided, multilayer, HDI, flex, rigid-flex, metal-core |
| Materials | FR-4 (standard, high-Tg, halogen-free), Isola 370HR / FR408HR, Rogers, PTFE / Teflon, polyimide, Nelco, Megtron 6, BT resin, aluminum |
| Via technology | Through-hole, blind, buried, stacked vias, laser microvias, VIPPO, conductive and non-conductive via fill, back drill |
| Build processes | Sequential lamination and build-up HDI structures |
| Impedance | Controlled impedance to customer-specified targets and tolerances |
| Surface finishes | HASL (leaded and lead-free), ENIG, ENEPIG, immersion silver, immersion tin, OSP, hard gold, carbon ink |
| Solder mask colors | Green, matte green, black, matte black, white, blue, red, yellow, transparent and others on request |
| Accepted data | Gerber RS-274X, ODB++, IPC-2581, DXF |
More detail: circuit board materials · surface finishes
PCB Manufacturing Workflow
A multilayer board goes through these main stages. Single- and double-sided boards skip the lamination steps. HDI boards repeat some steps for each build-up layer. You can see more in the production walkthrough.
CAM review and DFM
Your data is checked against design rules for trace and space, drill-to-copper clearance, annular ring and solder mask. Questions are raised before production starts.
Stack-up and material confirmation
Laminate, copper weights, board thickness and impedance targets are confirmed, and the stack-up is finalized.
Inner-layer imaging and AOI
Inner layers are imaged and etched, then automated optical inspection checks them for shorts, opens and defects before lamination.
Lamination and drilling
Layers are pressed together. Holes are mechanically drilled, and microvias are laser-drilled where required.
Plating and outer layers
Holes are plated, outer layers are imaged and etched, and solder mask and legend are applied.
Surface finish and profiling
The specified finish is applied, then boards are routed or scored to their final outline.
Electrical test and final inspection
Boards are electrically tested against the netlist and inspected against the fabrication drawing before they are packed.
Quality Processes
Network PCB operates an ISO 9001:2015 quality management system and builds boards to IPC guidelines plus the requirements on your fabrication drawing. See our quality practices and certifications.
Design rule checks
CAM engineers check your data against process design rules before tooling is released.
Automated optical inspection
Inner layers are scanned for shorts, opens and foreign material before lamination.
Electrical test
Flying probe testing for prototypes and low volumes; fixture testing for larger series.
Impedance verification
Controlled-impedance designs are built to the specified targets and tolerances.
Tolerance verification
Pattern, drill, plating thickness and outline tolerances are checked against specification.
Documentation
Inspection and test records can be supplied when your project or industry requires them.
PCB Manufacturing FAQs
What types of PCBs does Network PCB manufacture?
Are your PCBs manufactured in the United States?
Which PCB materials are available?
What surface finishes can I choose?
Do you offer controlled impedance?
Can you build blind, buried and microvias?
How are bare boards tested?
What are your maximum layer count and minimum feature sizes?
What design files do you accept for PCB manufacturing?
Get a PCB Manufacturing Quote
Upload your Gerber or ODB++ data with your stack-up, material, finish, quantity and target date. Our team will review the design and come back with a quote.